For producing a transverse conductive layer

Properties

• Favourable alternative to the copper strip grid
• Long-term tested with good results
• Replaces conductive levelling compounds

Description

Very low emission, conductive dispersion product for producing a transverse conductive layer prior to the installation of conductive floor coverings using the recommended Thomsit adhesives. Suitable for use on screeds ready for covering, Thomsit levelling compounds and different Thomsit underlays.

Suitable for floor constructions which have to meet special electrostatic requirements acc. to RAL-RG 725/3 and tested under DIN EN 1081, DIN VDE 0100, part 610 (or national equivalents). Recommended for use e.g. in operations and computer rooms, laboratories, and in production and storage areas subject to explosion risk.